- BrandBEW
- Country of manufactureChina
Microelectronic Package
Product Description
Computer CPU,DSC chips
Integrated Circuit Package Housings
Carriers
Radar Microwave modules
Semiconductor Wafers
Electronic Communications Devices
Materials:Silicon Aluminum Alloys(AlSi Alloys)
Configuration:Platforms,Plug-ins,Flatpacks,TO Headers etc.
Advantages
CTE match to circuit boards and components;
High thermal conductivity and outstanding heat dissipation;
Low density;
Hermeticity;
Dimensional stability;
Corrosion Resistance;
Wafer Level Packaging;
Ease of manufacture.
AlSi Alloys Performance Parameters
|
Content |
Density g/cm³ |
CTE ppm/℃ |
Thermal Conductivity W/mK |
Tensile Strength MPa |
Yield Strength MPa |
Poisson's Ratio |
Elongation % |
Elastic Modulus GPa |
|
Al-27%Si |
17 |
175 |
170 |
130 |
91 |
|||
|
Al-42%Si |
160 |
200 |
187 |
1 |
105 |
|||
|
Al-50%Si |
140 |
220 |
210 |
<1 |
108 |
|||
|
Al-60%Si |
10 |
125 |
210 |
210 |
<1 |
111 |
||
|
Al-70%Si |
120 |
135 |
135 |
<1 |
114 |